STPS340 Просмотр технического описания (PDF) - STMicroelectronics
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производитель
STPS340 Datasheet PDF : 11 Pages
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Package Information
Figure 19.
Thermal resistance junction to
ambient versus copper surface
under each lead (epoxy printed
board FR4, eCU = 35 µm) (SMB flat)
Rth(j-a)(°C/W)
110
100
90
80
70
60
50
SMB flat
40
30
20
10
SCU(cm²)
0
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
STPS340
2
Package Information
● Band indicates cathode on SMB and SMC
● Epoxy meets UL94, V0
Table 4. DPAK dimensions
Ref
A
E
A
B2
A1
C2
A2
L2
B
H
L4
B
G
D
B2
R
C
C2
A1
R
D
C
E
A2
G
0.60 MIN.
H
V2
L2
L4
V2
Dimensions
Millimeters
Inches
Min. Max.
2.20 2.40
0.90 1.10
0.03 0.23
0.64 0.90
5.20 5.40
0.45 0.60
0.48 0.60
6.00 6.20
6.40 6.60
4.40 4.60
9.35 10.10
0.80 typ.
0.60 1.00
0°
8°
Min. Max.
0.086 0.094
0.035 0.043
0.001 0.009
0.025 0.035
0.204 0.212
0.017 0.023
0.018 0.023
0.236 0.244
0.251 0.259
0.173 0.181
0.368 0.397
0.031 typ.
0.023 0.039
0°
8°
6/11
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