BH12PB1WHFV Просмотр технического описания (PDF) - ROHM Semiconductor
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BH12PB1WHFV
ROHM Semiconductor
BH12PB1WHFV Datasheet PDF : 11 Pages
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BH□□PB1WHFV Series
Technical Note
●Block diagram, recommended circuit diagram, and pin assignment table
BH□□PB1WHFV
PIN No. Symbol
Function
1
STBY Output voltage on/off control(High: ON, Low: OFF)
2
GND Ground
3
VIN
Power supply input
4
VOUT Voltage output
Mode switching
5
SEL (High: Fix in high-speed mode
Low: Automatic low-consumption mode switching)
VIN
3
Cin
CH1
-
-
+
GND
2
STBY
Rss
()
1
Css ( )
VOLTAGE
REFERENCE
--
+
SOFFT
START
CONTROL
BLOCK
THERMAL &
OVER CURRENT
PROTECTION
VOUT
4
Co
CH2
DISCHARGE
CURRENT
MONITOR
5
SEL
Cin … 0.47 µF
Co … 0.47 µF
Fig.25
●Auto Power-saving Function
The IC incorporates a built-in auto power-saving function that
continuously monitors the output current and switches
automatically between a low current consumption regulator
and a high-speed operation regulator. This function reduces
the regulator's own current consumption to approximately 1/10
or lower of normal levels when the output current falls below
approximately 300 A.
To operate only the high-speed operation regulator without
using the auto power-saving function, fix the SEL pin to high.
30
Measurement conditions
High-speed mode
20
BH12PB1WHFV
VCC = 2.2 V
10
VSEL = open,
Low-consumption mode
0
VSTBY = 1.5 V
0
0.5
1
1.5
2
2.5
3
Out put current IOUT [ mA]
Fig.26 Auto Power-Saving Function (Example)
●Power Dissipation (Pd)
1. Power Dissipation (Pd)
Power dissipation calculations include estimates of power
dissipation characteristics and internal IC power consumption, and
should be treated as guidelines. In the event that the IC is used in
an environment where this power dissipation is exceeded, the
attendant rise in the junction temperature will trigger the thermal
shutdown circuit, reducing the current capacity and otherwise
degrading the IC's design performance. Allow for sufficient margins
so that this power dissipation is not exceeded during IC operation.
2. Power Dissipation/Heat Reduction (Pd)
HVSOF5
0.6
410 mW
0.4
*Circuit design
should allow a
sufficient
margin for the
temperature
range so that
PMAX < Pd.
0.2
Calculating the maximum internal IC power consumption (PMAX)
PMAX = (VIN - VOUT) IOUT (MAX.)
VIN : Input voltage
VOUT : Output voltage
IOUT (MAX) : Max. output current
0
0
25
50
75
100
125
Ta[℃]
Fig.27 HVSOF5 Power Dissipation
vs Heat Reduction (Example)
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© 2011 ROHM Co., Ltd. All rights reserved.
6/10
2011.01 - Rev.B
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