36911600000 Просмотр технического описания (PDF) - Littelfuse, Inc
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36911600000 Datasheet PDF : 3 Pages
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Introduction toRCaidricauliLt eParodtFeuctsieosn
TE5® > Time-LagTr>an3s6i9eSnteorlioegsy
Temperature Rerating Curve
Soldering Parameters - Wave Soldering
300
280
260
240
220
200
180
160
140
120
100
80
60
40
20
0
Time (Seconds)
Preheat Time
Dwell Time
Cooling Time
Average Time Current Curves
100000
10000
1000
100
10
1
0.1
0.01
0.001
0.1
1
10
100
1000
CURRENT IN AMPERES
Recommended Process Parameters:
Wave Parameter
Preheat:
(Depends on Flux Activation Temperature)
Temperature Minimum:
Temperature Maximum:
Preheat Time:
Lead-Free Recommendation
(Typical Industry Recommendation)
100° C
150° C
60-180 seconds
Solder Pot Temperature:
260° C Maximum
Solder Dwell Time:
2-5 seconds
Recommended Hand-Solder Parameters:
Solder Iron Temperature: 350° C +/- 5°C
Heating Time: 5 seconds max.
Note: These devices are not recommended for IR or
Convection Reflow process.
369 Series
164
Revised: May 5, 2009
© 2009 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/series/369.html for current information.
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