MX887D Просмотр технического описания (PDF) - Unspecified
Номер в каталоге
Компоненты Описание
производитель
MX887D Datasheet PDF : 6 Pages
| |||
3 Manufacturing Information
MX887D
3.1 Mechanical Dimensions
3.1.1 TSOT23 3-Lead Package
2.80 / 3.00
(0.110 / 0.118)
3
0º / 8º
0.10 MIN
(0.004 MIN)
Recommended PCB Land Pattern
2.60 / 3.00
(0.102 / 0.118)
1.50 / 1.70
(0.059 / 0.067)
0.37 / 0.47
(0.015 / 0.019)
2.70
(0.106)
1.05
(0.041)
1
2
0.75 / 0.90
(0.030 / 0.035)
0.35 / 0.51
(0.014 / 0.020)
5º NOM
0.70 / 0.80
(0.028 / 0.031)
7º NOM
0.60 REF
(0.0236 REF)
0.25 BSC
(0.0098 BSC)
0.10 / 0.25
(0.004 / 0.010)
0.95
(0.037)
0.60
(0.024)
0.00 / 0.10
(0.000 / 0.004)
1.90 BSC
(0.0748 BSC)
0.95 BSC
(0.037 BSC)
Dimensions
mm MIN / mm MAX
(inches MIN / inches MAX)
Notes: (Unless otherwise specified)
1. Dimension “D” does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, and gate burrs shall not exceed 0.10mm
(0.004 inches) per side.
2. Dimension “E” does not include inter-lead flash or protrusions. Inter-lead flash and protrusions shall not exceed 0.15mm (0.006 inches) per side.
3. Package top may be smaller than package bottom. Dimensions “D” and “E1” are determined at the outermost extreme of the plastic body
excluding mold flash, tie bar burrs, gate burrs, and interlead flash, but including any mismatch between top and bottom of the plastic body.
3.1.2 Tape & Reel Packaging
178 DIA.
(7.01 DIA.)
0.25 ± 0.05
(0.001 ± 0.002)
Top Cover
Tape Thickness
0.066 MAX.
(0.003 MAX.)
ø1.5, +0.1, -0
(ø0.059, +0.004, -0)
P=4.0 ± 0.1
(0.157 ± 0.004)
2.0 ± 0.05
(0.079 ± 0.002)
3.5 ± 0.05
(0.138 ± 0.002)
1.75 ± 0.1
(0.069 ± 0.004)
Embossed Carrier
August 10, 2009
BO=3.2 ± 0.1
(0.126 ± 0.004)
K0=1.1 ± 0.1
(0.043 ± 0.004)
P=4.0 ± 0.1
(0.157 ± 0.004)
AO=3.2 ± 0.1
(0.126 ± 0.004)
ø1.1 ± 0.1
(0.043 ± 0.004)
W=8.0 ± 0.2
(0.315 ± 0.008)
Dimensions
mm
(inches)
Embossment
NOTE: Tape dimensions not shown comply with JEDEC Standard EIA-481-2
www.clare.com
5
Share Link: 