ADXL212 Просмотр технического описания (PDF) - Analog Devices
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ADXL212 Datasheet PDF : 12 Pages
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ADXL212
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
Acceleration (Any Axis, Unpowered)
Acceleration (Any Axis, Powered)
VS
Output Short-Circuit Duration
(Any Pin to Common)
Operating Temperature Range
Storage Temperature Range
Rating
1000 g
1000 g
−0.3 V to +7.0 V
Indefinite
−55°C to +125°C
−65°C to +150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 3. Thermal Resistance
Package Type
θJA
8-Lead Ceramic LCC 120°C/W
θJC
20°C/W
Device Weight
<1.0 g
ESD CAUTION
TP
TL
TSMAX
TSMIN
RAMP-UP
CRITICAL ZONE
tP
TL TO TP
tL
tS
PREHEAT
RAMP-DOWN
Table 4. Soldering Profile
Profile Feature
Average Ramp Rate (TL to TP)
Preheat
Minimum Temperature (TSMIN)
Minimum Temperature (TSMAX)
Time (TSMIN to TSMAX) (tS)
TSMAX to TL
Ramp-Up Rate
Time (tL) Maintained Above Liquidous (TL)
Liquidous Temperature (TL)
Time (tL)
Peak Temperature (TP)
Time Within 5°C of Actual Peak Temperature (tP)
Ramp-Down Rate
Time 25°C to Peak Temperature
t25°C TO PEAK
TIME
Figure 2. Recommended Soldering Profile
Condition
Sn63/Pb37
3°C/sec maximum
Pb Free
100°C
150°C
60 sec to 120 sec
150°C
200°C
60 sec to 150 sec
3°C/sec maximum
183°C
60 sec to 150 sec
240°C +0°C/–5°C
10 sec to 30 sec
6 minutes maximum
217°C
60 sec to 150 sec
260°C +0°C/–5°C
20 sec to 40 sec
6°C/sec maximum
8 minutes maximum
Rev. 0 | Page 4 of 12
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