HA13152 Просмотр технического описания (PDF) - Hitachi -> Renesas Electronics

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HA13152

14 W x 4-channel BTL power IC

Hitachi -> Renesas Electronics 

HA13151, HA13152

Point of Application Board Design

1. Notes on Application Board’s Pattern Design

• For increasing stability, the connected line of VCC and OUTGND is better to be made wider and

lower impedance.

• For increasing stability, it is better to place the capacitor between VCC and GND (0.1 µF) close to

IC.

• For increasing stability, it is better to place C1 to C8 and R1 to R8, which are for stopping

oscillation, close to IC.

• It is better to place the grounding of resistor (Rg), between input line and ground, close to INGND

(Pin 12) because if OUTGND is connected to the line between Rg and INGND, THD will become

worse due to current from OUTGND.

Figure 1 Notes on Application Board’s Pattern Design

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