LG1628BXA Просмотр технического описания (PDF) - Agere -> LSI Corporation
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LG1628BXA Datasheet PDF : 12 Pages
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LG1628AXA SONET/SDH 2.488 Gbits/s
Transimpedance Amplifier
Preliminary Data Sheet
January 1998
Typical Connections and Padout of the Hybrid Integrated Circuit
OUT+*
50 Ω
OUT–*
50 Ω
IN+
APD
APD+
60x30 7
5
9
10
17
2
16
18
15
13
60X30
8
6
60X30
12
14
4
19
60X30
3
120X100
20
+VDET
VSS
GND THERMISTOR
5-5336(F).r3
* OUT– is delayed approximately 25 ps with respect to OUT+ due to the longer microstrip line associated with OUT–. An extra delay should be
added to OUT+ before connecting to the next circuit.
Figure 3. Typical Connections to the HIC (See Figure 4 for a Schematic of the Circuitry on the HIC.)
Table 2. HIC Pad Functional Description
Symbol
IN+
APD+
+VDET
VSS
GND
Thermistor
OUT+
OUT–
Description
Amplifier input; connect to detector anode, current should enter this node.
RF bypassed connection for the cathode of the APD.
APD power supply connection.
Supply voltage; –5.2 Vdc nominal.
Ground (back of HIC is also ground).
Negative temperature coefficient thermistor for APD gain control.
Noninverted data output (produces high-level output for current entering IN+).
Inverted data output (produces low-level output for current entering IN+).
4
Lucent Technologies Inc.
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