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FDN340P_F095 Просмотр технического описания (PDF) - Fairchild Semiconductor

Номер в каталоге
Компоненты Описание
производитель
FDN340P_F095
Fairchild
Fairchild Semiconductor Fairchild
FDN340P_F095 Datasheet PDF : 5 Pages
1 2 3 4 5
Electrical Characteristics
Symbol
Parameter
TA =25°C unless otherwise noted
Test Conditions
Min Typ Max Units
Off Characteristics
BV DSS
Drain–Source Breakdown Voltage
BV DSS
TJ
Breakdown Voltage Temperature
Coefficient
IDSS
Zero Gate Voltage Drain Current
IGSSF
IGSSR
Gate–Body Leakage, Forward
Gate–Body Leakage, Reverse
On Characteristics (Note 2)
V GS(th)
Gate Threshold Voltage
V GS(th)
TJ
RDS(on)
Gate Threshold Voltage
Temperature Coefficient
Static Drain–Source
On–Resistance
ID(on)
On–State Drain Current
gFS
Forward Transconductance
Dynamic Characteristics
600
Input Capacitance
175
Output Capacitance
80
Reverse Transfer Capacitance
VGS = 0 V, ID = –250 µA
–20
ID = –250 µA,Referenced to 25°C
VDS = –16 V, VGS = 0 V
VDS = –16 V, VGS = 0 V,TJ=55°C
VGS = 8 V,
VDS = 0 V
VGS = –8 V, VDS = 0 V
V
–12
mV/°C
–1
µA
–10
100 nA
–100 nA
VDS = VGS, ID = –250 µA
–0.4
ID = –250 µA,Referenced to 25°C
VGS = –4.5 V, ID = –2 A
VGS = –4.5 V, ID = –2 A,TJ=125°C
VGS= –2.5 V, ID = –1.7A,
VGS = –4.5 V, VDS = –5 V
–5
VDS = –4.5 V, ID = –2 A
–0.8
3
60
77
82
9
–1.5
70
120
110
V
mV/°C
m
A
S
VDS = –10 V, V GS = 0 V,
f = 1.0 MHz
779
pF
121
pF
56
pF
Switching Characteristics
td(on)
Turn–On Delay Time
tr
Turn–On Rise Time
td(off)
Turn–Off Delay Time
tf
Turn–Off Fall Time
Qg
Total Gate Charge
Qgs
Gate–Source Charge
Qgd
Gate–Drain Charge
(Note 2)
VDD = –10 V, ID = –1 A,
VGS = –4.5 V, RGEN = 6
VDS = –10V, ID = –3.5 A,
VGS = –4.5 V
Drain–Source Diode Characteristics and Maximum Ratings
IS
Maximum Continuous Drain–Source Diode Forward Current
VSD
Drain–Source Diode Forward
Voltage
VGS = 0 V, IS = –0.42 A (Note 2)
10 20
ns
9
10
ns
27 43
ns
11 20
ns
7.2 10
nC
1.7
nC
1.5
nC
–0.42 A
–0.7 –1.2 V
Notes:
1. RθJAis the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of
the drain pins. RθJC is guaranteed by design while RθCAis determined by the user's board design.
a. 250°C/W when mounted on a
0.02in2 pad of 2 oz copper
b. 270°C/W when mounted on a
.001 in2 pad of 2 oz copper
Scale 1 : 1 on letter size paper
2.Pulse Test: Pulse Width <300µs, Duty Cycle <2.0%
FDN340P Rev E1

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