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AS1700-NPN

Semicustom Bipolar Array

Astec Semiconductor => Silicon Link 

AS17xx

Semicustom Bipolar Array

so that they may also be used to create a device

with an integral emitter area ratio with respect to

a standard small NPN.

The AS17xx bipolar array can be packaged in

industry standard DIP or surface mount pack-

ages with 8 to 40 leads. The number of pads

available on the AS17xx varies with the number

of tiles used as follows: single tile per die = 18

pads, two tiles per die = 30 pads, and four tiles

per die = 40 pads. The extra pads not used for

bonding to leads can be used for wafer level

testing, trimming, and debugging.

Pin Configuration — Top view

PDIP (N)

AS1700-NPN Kit Part

PDIP (N)

AS1700-PNP Kit Part

SUB 1

C2

B3

E4

C5

B6

E7

14 Vbe

13 C

12 B

11 E

10 C

9B

8E

SUB 1

C2

B3

E4

C5

B6

E7

14 C

13 C

12 B

11 E

10 C

9B

8E

Die Configuration — Top view

PDIP (N)

AS1700-PWR Kit Part

SUB 1

C2

B3

E4

C5

B6

E7

14 E

13 C

12 B

11 E

10 B

9B

8E

ASTEC Semiconductor

Figure 1. Single Tile Bipolar Array

120

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