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TCM850 Просмотр технического описания (PDF) - TelCom Semiconductor Inc => Microchip

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Компоненты Описание
производитель
TCM850
TelCom-Semiconductor
TelCom Semiconductor Inc => Microchip TelCom-Semiconductor
TCM850 Datasheet PDF : 7 Pages
1 2 3 4 5 6 7
REGULATED GaAs FET BIAS SUPPLY
1 TCM850
TCM851
TCM852
TCM853
Shutdown Mode
Shutdown inputs are provided to reduce TCM850/1/3
supply current during idle periods. When the shutdown input
is in its active state, supply current over temperature is
reduced to 0.5µA (typ) TCM850/2/3 and 2µA (typ) TCM851.
All shutdown inputs are TTL level compatible: TCM850 and
TCM853 both have active low inputs (SHDN) while the
TCM851 has an active high input. The TCM852 can be
shutdown by setting the OSC input to a logic low level. The
TCM852 exits the shutdown state when the clock signal is
again restored.
Charge Pump Frequency Control
In applications where the charge pump switching fre-
quency may cause interference or filtering problems, it is
recommended the TCM852 be used. Switching frequency is
determined by a 50kHz to 250kHz square wave signal
applied to the OSC input. The signal applied to OSC can
have a duty cycle between 40% and 60%. *Note: an external
oscillator signal MUST be applied to the TCM852. The
TCM852 does not have an on-board oscillator truebase.
Capacitors
Capacitors with low effective series resistance (ESR)
should be used to maintain sufficient headroom across the
linear post regulator. Recommended values for C1, C2, and
C3 are 1µF, 0.8ESR. The recommended value for C4 is
10µF, 0.2. All capacitors should be either surface mount
chip tantalum, or chip ceramic types.
Board Layout
The TCM850/1/2/3 typically finds use in applications
where low output noise is important. To ensure good noise
performance, please observe the following basic layout
suggestions:
(1) Mount all components in the circuit as close together
as possible.
(2) Keep trace lengths short; especially those to control
inputs such as FB and CONT. This will reduce the
effect of parasitic capacitance and inductance.
(3) Minimize ground impedance by employing a ground
plane.
Noise and Ripple Measurement
2 The TCM850/1/2/3 charge pump switching action causes
small ground voltage differences between the TCM850/1/2
/3 circuit and the oscilloscope. These voltage differences
cause ground currents in the probe wires inducing voltage
spikes and result in erroneous readings. As a result, noise
and ripple measurements should be made directly across
output capacitor C4. Do not use the ground lead of the
oscilloscope probe. Instead, remove the plastic cover from
3 the probe tip and touch the probe ground ring directly to the
negative side of C4. Tektronix chassis mount test jack (part
number 131-0258) or a nail-type probe tip connect to the
probe and minimize noise and ripple measurement error.
Evaluation Kit
TelCom Semiconductor offers evaluation kit
4 (TCM850EV) for the TCM850-853. A second evaluation kit
(TC7660EV) evaluates several TelCom charge pumps in-
cluding the TC7660, TC7660S, TC7662B, TC962, TC682.
This kit also supports the TCM850 (but not the TCM851-
853).
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TELCOM SEMICONDUCTOR, INC.
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4-31

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