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HT1621 Просмотр технического описания (PDF) - Holtek Semiconductor

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HT1621 Datasheet PDF : 20 Pages
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CS
RD
WR
D ATA
VSS
O SCO
O SCI
V LC D
VDD
IR Q
BZ
BZ
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H T1621B
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4 8 L Q F P -A
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HT1621
Pad Assignment
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RD 2
WR 3
D ATA 4
(0 ,0 )
VSS 5
O SCO 6
O SCI 7
V LC D 8
VDD 9
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Rev. 1.30
Chip size: 127 ´ 131 (mil)2
Bump height: 18mm ± 3mm
Min. Bump spacing: 72.36mm
Bump size: 96.042 ´ 96.042mm2
* The IC substrate should be connected to VDD in the PCB layout artwork.
3
August 6, 2003

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