HCTS32D Просмотр технического описания (PDF) - Intersil
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HCTS32D Datasheet PDF : 9 Pages
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Die Characteristics
DIE DIMENSIONS:
87 x 88 mils
2.20 x 2.2mm
METALLIZATION:
Type: SiAl
Metal Thickness: 11kÅ ± 1kÅ
GLASSIVATION:
Type: SiO2
Thickness: 13kÅ ± 2.6kÅ
WORST CASE CURRENT DENSITY:
<2.0 x 105A/cm2
BOND PAD SIZE:
100µm x 100µm
4 x 4 mils
Metallization Mask Layout
B1 (2)
HCTS32MS
HCTS32MS
A1
VCC
B4
(1)
(14)
(13)
Y1 (3)
A2 (4)
B2 (5)
(6)
(7)
(8)
Y2
GND
Y3
(12) A4
(11) Y4
(10) B3
(9) A3
Spec Number 518638
457
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