HCTS02D Просмотр технического описания (PDF) - Intersil
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HCTS02D Datasheet PDF : 11 Pages
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Die Characteristics
DIE DIMENSIONS:
87 x 88 mils
2.20mm x 2.24mm
METALLIZATION:
Type: SiAl
Metal Thickness: 11kÅ ± 1kÅ
GLASSIVATION:
Type: SiO2
Thickness: 13kÅ ± 2.6kÅ
WORST CASE CURRENT DENSITY:
<2.0 x 105A/cm2
BOND PAD SIZE:
100µm x 100µm
4 x 4 mils
Metallization Mask Layout
A1 (2)
HCTS02MS
HCTS02MS
Y1
VCC
Y4
(1)
(14)
(13)
B1 (3)
Y2 (4)
A2 (5)
(6)
(7)
(8)
B2
GND
A3
(12) B4
(11) A4
(10) Y3
(9) B3
Spec Number 518841
8
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