CD4089BMS Просмотр технического описания (PDF) - Intersil
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CD4089BMS Datasheet PDF : 10 Pages
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CD4089BMS
Typical Performance Characteristics (Continued)
200 AMBIENT TEMPERATURE (TA) = +25oC
AMBIENT TEMPERATURE (TA) = +25oC
150
SUPPLY VOLTAGE (VDD) = 15V
200
100
10V
SUPPLY VOLTAGE (VDD) = 5V
150
5V
100
10V
50
15V
50
0
20
40
60
80
100
LOAD CAPACITANCE (CL) (pF)
0
0
20
40
60
80
100
LOAD CAPACITANCE (CL) (pF)
FIGURE 9. TYP. PROPAGATION DELAY TIMES AS FUNCTION OF FIGURE 10. TYPICAL TRANSITION TIME AS A FUNCTION OF
LOAD CAPACITANCE (CLOCK OR STROBE TO OUT)
LOAD CAPACITANCE
105 8
6
4
2
AMBIENT TEMPERATURE (TA) = +25oC
SUPPLY VOLTAGE (VDD) = 15V
104 8
6
4
2
103 8
6
4
2
10V
10V
5V
102 8
6
4
CL = 50pF
2
10
1
CL = 15pF
2 4 68 2 4 68 2 4 68 2 4 68 2 4 68
10
102
103
104
INPUT FREQUENCY (fIN) (kHz)
FIGURE 11. TYPICAL DYNAMIC POWER DISSIPATION AS A FUNCTION OF INPUT FREQUENCY
Chip Dimensions and Pad Layout
Dimensions in parenthesis are in millimeters and are
derived from the basic inch dimensions as indicated.
Grid graduations are in mils (10-3 inch).
METALLIZATION: Thickness: 11kÅ − 14kÅ, AL.
PASSIVATION: 10.4kÅ - 15.6kÅ, Silane
BOND PADS: 0.004 inches X 0.004 inches MIN
DIE THICKNESS: 0.0198 inches - 0.0218 inches
7-1073
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