CD4031BMS Просмотр технического описания (PDF) - Intersil
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CD4031BMS Datasheet PDF : 10 Pages
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CD4031BMS
VDD
DATA
QD
QD
QD
15
6
15
6
15
6
15
6
Q
MODE
10 CD4031BMS
10 CD4031BMS
10 CD4031BMS
10 CD4031BMS
CONTROL
19
2
19
2
19
2
19 2
RECIRC
IN
CLD CL
CLD CL
CLD CL
CLD CL
CLOCK
DRIVER
DELAYED
CLOCK
TO CLOCK
NEW DATA
INTO FIRST
REGISTER
(1/2 - CD4013B)
D
Q
FF*
CL
*FOR RECIRCULATION MODE ONLY
FF TO DELAY DATA UNTIL
FISRT REGISTERED DELAYED CLOCKING
HAS OCCURED
MODE CONTROL VDD = RECIRCULATION
GND = NEW DATA
FIGURE 11. CASCADING USING DELAYED CLOCKING FOR REDUCED CLOCK DRIVE REQUIREMENTS
VDD
DATA
Q’ D
Q’ D
Q’ D
15
5
15
5
15
5
15
5
Q’
MODE
10 CD4031BMS
10 CD4031BMS
10 CD4031BMS
10 CD4031BMS
CONTROL
12
12
12
12
6
RECIRC
IN
CL
CL
CL
CL
CLOCK DRIVER
MODE CONTROL VDD = RECIRCULATION
GND = NEW DATA
FIGURE 12. CASCADING USING HALF-CLOCK-PULSE DELAYED OUTPUT (Q’) TO PERMIT
USE OF SLOW RISE AND FALL CLOCK INPUTS
Chip Dimensions and Pad Layout
METALLIZATION: Thickness: 11kÅ − 14kÅ, AL.
PASSIVATION: 10.4kÅ - 15.6kÅ, Silane
BOND PADS: 0.004 inches X 0.004 inches MIN
DIE THICKNESS: 0.0198 inches - 0.0218 inches
Dimensions in parentheses are in millimeters
and are derived from the basic inch dimensions
as indicated. Grid graduations are in mils (10-3 inch)
7-825
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