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LM235DT Просмотр технического описания (PDF) - STMicroelectronics

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Компоненты Описание
производитель
LM235DT
ST-Microelectronics
STMicroelectronics ST-Microelectronics
LM235DT Datasheet PDF : 16 Pages
First Prev 11 12 13 14 15 16
LM135-LM235-LM335
6
Package information
Package information
In order to meet environmental requirements, STMicroelectronics offers these devices in
ECOPACK® packages. These packages have a lead-free second level interconnect. The
category of second level interconnect is marked on the package and on the inner box label,
in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an STMicroelectronics
trademark. ECOPACK specifications are available at: www.st.com.
6.1
TO-92 tape & reel package information
Figure 23. TO-92 tape & reel package mechanical drawing
A1
P
T
P
H
d
D0
F1 F2
P2
P0
11/16

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