HI5735(1998) Просмотр технического описания (PDF) - Intersil

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производитель

HI5735
(Rev.:1998)

12-Bit, 80 MSPS, High Speed Video D/A Converter

Intersil 

Die Characteristics

DIE DIMENSIONS:

161.5 mils x 160.7 mils x 19 mils ±1 mil

METALLIZATION:

Type: AlSiCu

Thickness: M1 - 8kÅ, M2 - 17kÅ

PASSIVATION:

Type: Sandwich Passivation

Undoped Silicon Glass (USG) + Nitride

Thickness: USG - 8kÅ, Nitride - 4.2kÅ

Total 12.2kÅ ± +2kÅ

Metallization Mask Layout

HI5735

DIE ATTACH:

Silver Filled Epoxy

SUBSTRATE POTENTIAL (Powered Up):

VEED

HI5735

D8

D9 D10 D11

DGND

D7

D6

D5

D4

D3

D2

D1

D0

CTRL OUT

CTRL IN

RSET

AVEE

IOUT

IOUT

ARTN

CLK DVCC DGND

DVEE

1630

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