LSP1012 Просмотр технического описания (PDF) - Microsemi Corporation
Номер в каталоге
Компоненты Описание
производитель
LSP1012 Datasheet PDF : 3 Pages
| |||
LSP1000 – LSP1012
ENHANCED PERFORMANCE SURFACE MOUNT
TM
®
EPSM® PIN Diodes
RoHS Compliant
MECHANICAL OPTIONS
EPSM products are available in a broad range of mechanical configurations. The standard package style is the 450
series. This series has several sizes available to accommodate the internal chip configurations. The 450A is the most
common configuration for single diode applications. The 454 series package style is a three terminal configuration
designed to accommodate 2 chip for ‘T” and common anode/cathode designs. With uniform ‘flat-top’ construction, the
450 series of EPSM products are ideally suited for tape and reel / automated assembly.
The 150 series of EPSM products have a ‘glob-top’ construction and are traditionally used in smaller volume
applications.
PACKAGE STYLE 150X
PACKAGE STYE 450X
PACKAGE STYLE 154
PACKAGE STYPE 454
Copyright 2007
Rev: 2009-09-10
Microsemi
Microwave Products
75 Technology Drive, Lowell, MA. 01851, 978-442-5600, Fax: 978-937-3748
Page 3
Share Link: 