HFA1113/883 Просмотр технического описания (PDF) - Intersil
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HFA1113/883 Datasheet PDF : 22 Pages
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Burn-In Circuits
HFA1113/883
HFA1113MJ/883 CERAMIC DIP
1
300
8
300
D3
NC 2
-
7
V+
3
+
6
C1 D1
D4
V-
4
5
R1
D2
C2
NOTES:
R1 = 100Ω, ±5% (Per Socket)
C1 = C2 = 0.01µF (Per Socket) or 0.1µF (Per Row) Minimum
D1 = D2 = 1N4002 or Equivalent (Per Board)
D3 = D4 = 1N4002 or Equivalent (Per Socket)
V+ = +5.5V ±0.5V
V- = -5.5V ±0.5V
HFA1113ML/883 CERAMIC LCC
3 2 1 20 19
4
300
18
NC 5 300
17
R1
6
-
+
16
7
15
8
14
R2
9 10 11 12 13
D4
V-
D2
C2
D3
V+
C1 D1
NOTES:
R1 = 1kΩ, ±5% (Per Socket)
R2 = 100Ω, ±5% (Per Socket)
C1 = C2 = 0.01µF (Per Socket) or 0.1µF (Per Row) Minimum
D1 = D2 = 1N4002 or Equivalent (Per Board)
D3 = D4 = 1N4002 or Equivalent (Per Socket)
V+ = +5.5V ±0.5V
V- = -5.5V ±0.5V
Spec Number 511106-883
195
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