HFA1113/883 Просмотр технического описания (PDF) - Intersil
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HFA1113/883 Datasheet PDF : 22 Pages
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HFA1113/883
Die Characteristics
DIE DIMENSIONS:
63 x 44 x 19 mils ± 1 mils
1600 x 1130 x 483µm ± 25.4µm
METALLIZATION:
Type: Metal 1: AICu(2%)/TiW
Thickness: Metal 1: 8kÅ ± 0.4kÅ
Type: Metal 2: AICu(2%)
Thickness: Metal 2: 16kÅ ± 0.8kÅ
GLASSIVATION:
Type: Nitride
Thickness: 4kÅ ± 0.5kÅ
WORST CASE CURRENT DENSITY:
2.0 x 105 A/cm2 at 47.5mA
TRANSISTOR COUNT: 52
SUBSTRATE POTENTIAL (Powered Up): Floating (Recommend Connection to V-)
Metallization Mask Layout
HFA1113/883
NC
+IN
V-
VL
-IN
NC
VH
V+
OUT
Spec Number 511106-883
193
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