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HCPL-4100

Optically Coupled 20 mA Current Loop Transmitter

HP => Agilent Technologies 

Regulatory Information

The HCPL-4100 has been

approved by the following

organizations:

UL

Recognized under UL 1577,

Component Recognition

Program, File E55361.

CSA

Approved under CSA Component

Acceptance Notice #5, File CA

88324.

Insulation and Safety Related Specifications

Parameter

Symbol Value Units

Conditions

Min. External Air Gap

(External Clearance)

L(IO1) 7.1 mm Measured from input terminals to output

terminals, shortest distance through air

Min. External Tracking Path

(External Creepage)

L(IO2) 7.4 mm Measured from input terminals to output

terminals, shortest distance path along body

Min. Internal Plastic Gap

(Internal Clearance)

0.08 mm Through insulation distance, conductor to

conductor, usually the direct distance

between the photoemitter and photodetector

inside the optocoupler cavity

Tracking Resistance

CTI

(Comparative Tracking Index)

200 Volts DIN IEC 112/VDE 0303 PART 1

Isolation Group

IIIa

Material Group (DIN VDE 0110, 1/89, Table 1)

Option 300 – surface mount classification is Class A in accordance with CECC 00802.

Absolute Maximum Ratings

(No Derating Required up to 55°C)

Storage Temperature .................................................. -55°C to +125°C

Operating Temperature ................................................. -40°C to +85°C

Lead Solder Temperature .... 260°C for 10 s (1.6 mm below seating plane)

Supply Voltage – VCC .............................................................. 0 V to 20 V

Average Output Current - IO ........................................ -30 mA to 30 mA

Peak Output Current - IO ........................................... Internally Limited

Output Voltage – VO ........................................................ -0.4 V to 27 V

Input Voltage – VI ............................................................ -0.5 V to 20 V

Input Power Dissipation – PI ................................................. 265 mW[1]

Output Power Dissipation – PO ............................................. 125 mW[2]

Total Power Dissipation – P .................................................. 360 mW[3]

Infrared and Vapor Phase Reflow Temperature

(Option #300) .......................................... see Fig. 1, Thermal Profile

1-364

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