MC13150FTA Просмотр технического описания (PDF) - Motorola => Freescale
Номер в каталоге
Компоненты Описание
производитель
MC13150FTA Datasheet PDF : 20 Pages
| |||
MC13150
OUTLINE DIMENSIONS
FTA SUFFIX
PLASTIC PACKAGE
CASE 977–01
(LQFP–24)
4X
9
ISSUE O
0.200 (0.008) AB T–U Z
A
A1
24
19
DETAIL Y
1
–T–
V
6
V1
18
–U–
B
B1
13
7
12
–Z–
S1
S
4X
0.200 (0.008) AB T–U Z
DETAIL AD
–AB–
CE
M_
TOP & BOTTOM
R
–AC–
0.080 (0.003) AC
–T–, –U–, –Z–
AE AE
H
W
K
Q_
GAUGE
PLANE
P
X
0.250 (0.010)
G
DETAIL AD
DETAIL Y
NOTES:
1 DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2 CONTROLLING DIMENSION: MILLIMETER.
3 DATUM PLANE –AB– IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
4 DATUMS –T–, –U–, AND –Z– TO BE DETERMINED
AT DATUM PLANE –AB–.
5 DIMENSIONS S AND V TO BE DETERMINED AT
DATUM PLANE –AC–.
6 DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS
0.250 (0.010) PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE –AB–.
7 DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE D DIMENSION TO EXCEED
0.350 (0.014).
8 MINIMUM SOLDER PLATE THICKNESS SHALL BE
0.0076 (0.0003).
9 EXACT SHAPE OF EACH CORNER IS OPTIONAL.
MILLIMETERS
INCHES
DIM MIN MAX MIN MAX
A 4.000 BSC
0.157 BSC
A1 2.000 BSC
0.079 BSC
B 4.000 BSC
0.157 BSC
B1 2.000 BSC
0.079 BSC
C 1.400 1.600 0.055 0.063
D 0.170 0.270 0.007 0.011
E 1.350 1.450 0.053 0.057
F 0.170 0.230 0.007 0.009
G 0.500 BSC
0.020 BSC
H 0.050 0.150 0.002 0.006
J 0.090 0.200 0.004 0.008
K 0.500 0.700 0.020 0.028
M
12 _REF
12 _REF
N 0.090 0.160 0.004 0.006
P 0.250 BSC
0.010 BSC
Q 1_ 5_ 1_ 5_
R 0.150 0.250 0.006 0.010
S
6.000 BSC
0.236 BSC
S1 3.000 BSC
0.118 BSC
V
6.000 BSC
0.236 BSC
V1 3.000 BSC
0.118 BSC
W 0.200 REF
0.008 REF
X
1.000 REF
0.039 REF
J ÉÉÉÇÇÇÉÉÉÇÇÇÉÉÉÇÇÇ N
F
D
0.080 (0.003) S AC T–U S Z S
SECTION AE–AE
18
MOTOROLA ANALOG IC DEVICE DATA
Share Link: 