ADF4106BCP Просмотр технического описания (PDF) - Analog Devices

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производитель

ADF4106BCP

PLL Frequency Synthesizer

Analog Devices 

ADF4106

ABSOLUTE MAXIMUM RATINGS1, 2

(TA = 25°C unless otherwise noted.)

AVDD to GND3 . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +3.6 V

AVDD to DVDD . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +0.3 V

VP to GND . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +5.3 V

VP to AVDD . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +5.5 V

Digital I/O Voltage to GND . . . . . . . . –0.3 V to VDD + 0.3 V

Analog I/O Voltage to GND . . . . . . . . . –0.3 V to VP + 0.3 V

REFIN, RFINA, RFINB to GND . . . . . . –0.3 V to VDD + 0.3 V

Operating Temperature Range

Industrial (B Version) . . . . . . . . . . . . . . . –40°C to +85°C

Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C

Maximum Junction Temperature . . . . . . . . . . . . . . . . 150°C

TSSOP ␪JA Thermal Impedance . . . . . . . . . . . . . 150.4°C/W

CSP ␪JA Thermal Impedance . . . . . . . . . . . . . . . . . . 122°C/W

Lead Temperature, Soldering

Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . 215°C

Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220°C

NOTES

1Stresses above those listed under Absolute Maximum Ratings may cause perma-

nent damage to the device. This is a stress rating only; functional operation of the

device at these or any other conditions above those listed in the operational

sections of this specification is not implied. Exposure to absolute maximum rating

conditions for extended periods may affect device reliability.

2This device is a high-performance RF integrated circuit with an ESD rating of

<2 kV and it is ESD sensitive. Proper precautions should be taken for handling and

assembly.

3GND = AGND = DGND = 0 V

ORDERING GUIDE

Model

Temperature Range Package Option*

ADF4106BRU –40°C to +85°C

ADF4106BCP –40°C to +85°C

RU-16

CP-20

*RU = Thin Shrink Small Outline Package (TSSOP)

CP = Chip Scale Package

Contact the factory for chip availability.

Note that aluminum bond wire should not be used with the ADF4106 die.

CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily

accumulate on the human body and test equipment and can discharge without detection. Although the

ADF4106 features proprietary ESD protection circuitry, permanent damage may occur on devices

subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions are recommended

to avoid performance degradation or loss of functionality.

WARNING!

ESD SENSITIVE DEVICE

–4–

REV. 0

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