Nexperia
BAV70SRA
Quad high-speed switching diodes
9. Thermal characteristics
Table 6. Thermal characteristics
Symbol
Parameter
Conditions
Rth(j-a)
thermal resistance from in free air
junction to ambient
Rth(j-sp)
thermal resistance from
junction to solder point
Min Typ Max Unit
[1]
-
-
305 K/W
[2]
-
-
205 K/W
[3]
-
-
40
K/W
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated mounting pad for cathode 1cm2.
[3] Soldering point of cathode tab.
103
Zth(j-a)
(K/W)
102
duty cycle = 1
0.75
0.5
0.33
0.25
0.2
0.1
0.05
10 0.02
0.01
0
aaa-025767
1
10-5
10-4
10-3
10-2
10-1
1
FR4 PCB, standard footprint
10
102
103
tp (s)
Fig. 2. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
103
aaa-025766
Zth(j-a)
(K/W) duty cycle = 1
102 0.5
0.75
0.33
0.25
0.2
0.1
0.05
10 0.02
0.01
0
1
10-5
10-4
10-3
10-2
10-1
1
FR4 PCB, mounting pad for cathode 1 cm²
10
102
103
tp (s)
Fig. 3. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
BAV70SRA
Product data sheet
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14 September 2018
© Nexperia B.V. 2018. All rights reserved
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