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W25M02GVZEIT

3V 2G-BIT (2 x 1G-BIT) SERIAL SLC NAND FLASH MEMORY WITH DUAL/QUAD SPI BUFFER READ & CONTINUOUS READ CONCURRENT OPERATIONS

Winbond 

W25M02GV

3.3 Ball Configuration TFBGA 8x6-mm (5x5 or 6x4 Ball Array)

Figure 1b. W25M02GV Ball Assignments, 24-ball TFBGA 8x6-mm (Package Code TB & TC)

3.4 Ball Description TFBGA 8x6-mm

BALL NO.

B2

B3

B4

C2

C4

D2

D3

D4

Multiple

PIN NAME

CLK

GND

VCC

/CS

/WP (IO2)

DO (IO1)

DI (IO0)

/HOLD (IO3)

NC

I/O

FUNCTION

I

Serial Clock Input

Ground

Power Supply

I

Chip Select Input

I/O

Write Protect Input (Data Input Output 2)(2)

I/O Data Output (Data Input Output 1)(1)

I/O

Data Input (Data Input Output 0)(1)

I/O

Hold Input (Data Input Output 3)(2)

No Connect

Notes:

1. IO0 and IO1 are used for Standard and Dual SPI instructions

2. IO0 – IO3 are used for Quad SPI instructions, /WP & /HOLD functions are only available for Standard/Dual SPI.

Publication Release Date: July 1, 2015

-8-

Preliminary - Revision B

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