25M02GVZEIT Просмотр технического описания (PDF) - Winbond

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25M02GVZEIT

3V 2G-BIT (2 x 1G-BIT) SERIAL SLC NAND FLASH MEMORY WITH DUAL/QUAD SPI BUFFER READ & CONTINUOUS READ CONCURRENT OPERATIONS

Winbond 

W25M02GV

3. PACKAGE TYPES AND PIN CONFIGURATIONS

W25M02GV is offered in an 8-pad WSON 8x6-mm (package code ZE), and two 24-ball 8x6-mm TFBGA

(package code TB & TC) packages as shown in Figure 1a-b respectively. Package diagrams and

dimensions are illustrated at the end of this datasheet.

3.1 Pad Configuration WSON 8x6-mm

Top View

/CS

18

VCC

DO (IO1)

/WP (IO2)

GND

27

36

45

/HOLD (IO3)

CLK

DI (IO0)

Figure 1a. W25M02GV Pad Assignments, 8-pad WSON 8x6-mm (Package Code ZE)

3.2 Pad Description WSON 8x6-mm

PAD NO.

1

2

3

4

5

6

7

8

PAD NAME

/CS

DO (IO1)

/WP (IO2)

GND

DI (IO0)

CLK

/HOLD (IO3)

VCC

I/O

FUNCTION

I

Chip Select Input

I/O

Data Output (Data Input Output 1)(1)

I/O

Write Protect Input ( Data Input Output 2)(2)

Ground

I/O

Data Input (Data Input Output 0)(1)

I

Serial Clock Input

I/O

Hold Input (Data Input Output 3)(2)

Power Supply

Notes:

1. IO0 and IO1 are used for Standard and Dual SPI instructions

2. IO0 – IO3 are used for Quad SPI instructions, /WP & /HOLD functions are only available for Standard/Dual SPI.

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