W25M02GWTBIG Просмотр технического описания (PDF) - Winbond

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W25M02GWTBIG

1.8V 2G-BIT (2 x 1G-BIT) SERIAL SLC NAND FLASH MEMORY WITH DUAL/QUAD SPI BUFFER READ & CONTINUOUS READ CONCURRENT OPERATIONS

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W25M02GW

10.3 24-Ball TFBGA 8x6-mm (Package Code TC, 6x4 Ball Array) ............................................ 64

11. ORDERING INFORMATION .......................................................................................................... 65

11.1 Valid Part Numbers and Top Side Marking ........................................................................ 66

12. REVISION HISTORY...................................................................................................................... 67

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