W25M02GWZEIT Просмотр технического описания (PDF) - Winbond

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W25M02GWZEIT

1.8V 2G-BIT (2 x 1G-BIT) SERIAL SLC NAND FLASH MEMORY WITH DUAL/QUAD SPI BUFFER READ & CONTINUOUS READ CONCURRENT OPERATIONS

Winbond 

W25M02GW

Table of Contents

1. GENERAL DESCRIPTIONS............................................................................................................. 6

2. FEATURES....................................................................................................................................... 6

3. PACKAGE TYPES AND PIN CONFIGURATIONS .......................................................................... 7

3.1 Pad Configuration WSON 8x6-mm ...................................................................................... 7

3.2 Pad Description WSON 8x6-mm.......................................................................................... 7

3.3 Ball Configuration TFBGA 8x6-mm (5x5 or 6x4 Ball Array) ................................................. 8

3.4 Ball Description TFBGA 8x6-mm ......................................................................................... 8

4. PIN DESCRIPTIONS ........................................................................................................................ 9

4.1 Serial MCP (SpiStack® ) Device Configuration ..................................................................... 9

4.2 Chip Select (/CS) .................................................................................................................. 9

4.3 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) .................................... 9

4.4 Write Protect (/WP)............................................................................................................... 9

4.5 HOLD (/HOLD) ................................................................................................................... 10

4.6 Serial Clock (CLK) .............................................................................................................. 10

5. SINGLE DIE (W25N01GW) BLOCK DIAGRAM............................................................................. 11

6. FUNCTIONAL DESCRIPTIONS..................................................................................................... 12

6.1 Device Operation Flow ....................................................................................................... 12

6.1.1 Stacked Die Operations ........................................................................................................12

6.1.2 Standard SPI Instructions .....................................................................................................12

6.1.3 Dual SPI Instructions ............................................................................................................13

6.1.4 Quad SPI Instructions ...........................................................................................................13

6.1.5 Hold Function........................................................................................................................13

6.2 Write Protection .................................................................................................................. 14

7. PROTECTION, CONFIGURATION AND STATUS REGISTERS .................................................. 15

7.1 Protection Register / Status Register-1 (Volatile Writable, OTP lockable)......................... 15

7.1.1 Block Protect Bits (BP3, BP2, BP1, BP0, TB) – Volatile Writable, OTP lockable..................15

7.1.2 Write Protection Enable Bit (WP-E) – Volatile Writable, OTP lockable .................................16

7.1.3 Status Register Protect Bits (SRP1, SRP0) – Volatile Writable, OTP lockable.....................16

7.2 Configuration Register / Status Register-2 (Volatile Writable) ........................................... 17

7.2.1 One Time Program Lock Bit (OTP-L) – OTP lockable ..........................................................17

7.2.2 Enter OTP Access Mode Bit (OTP-E) – Volatile Writable .....................................................17

7.2.3 Status Register-1 Lock Bit (SR1-L) – OTP lockable .............................................................17

7.2.4 ECC Enable Bit (ECC-E) – Volatile Writable.........................................................................18

7.2.5 Buffer Read / Continuous Read Mode Bit (BUF) – Volatile Writable.....................................18

7.3 Status Register-3 (Status Only).......................................................................................... 19

7.3.1 Look-Up Table Full (LUT-F) – Status Only............................................................................19

7.3.2 Cumulative ECC Status (ECC-1, ECC-0) – Status Only .......................................................19

7.3.3 Program/Erase Failure (P-FAIL, E-FAIL) – Status Only........................................................20

7.3.4 Write Enable Latch (WEL) – Status Only ..............................................................................20

7.3.5 Erase/Program In Progress (BUSY) – Status Only...............................................................20

7.3.6 Reserved Bits – Non Functional ...........................................................................................20

7.4 Single Die W25N01GW Status Register Memory Protection............................................. 21

8. INSTRUCTIONS ............................................................................................................................. 22

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