STWHA12D-E1 Просмотр технического описания (PDF) - SEOUL SEMICONDUCTOR

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производитель

STWHA12D-E1

Mid-Power LED

SEOUL SEMICONDUCTOR 

Reflow Soldering Characteristics

Product Data Sheet

STWHA12D-E1 – Mid-Power LED

Profile Feature

Average ramp-up rate (Ts_max to Tp)

Preheat

- Temperature Min (Ts_min)

- Temperature Max (Ts_max)

- Time (Ts_min to Ts_max) (ts)

Time maintained above:

- Temperature (TL)

- Time (tL)

Peak Temperature (Tp)

Time within 5°C of actual Peak

Temperature (tp)2

Ramp-down Rate

Time 25°C to Peak Temperature

IPC/JEDEC J-STD-020

Sn-Pb Eutectic Assembly

3° C/second max.

100 °C

150 °C

60-120 seconds

183 °C

60-150 seconds

215℃

10-30 seconds

6 °C/second max.

6 minutes max.

Pb-Free Assembly

3° C/second max.

150 °C

200 °C

60-180 seconds

217 °C

60-150 seconds

260℃

20-40 seconds

6 °C/second max.

8 minutes max.

Caution :

(1) Reflow soldering is recommended not to be done more than two times

In the case of more than 24 hours passed soldering after first, LEDs will be damaged.

(2) Repairs should not be done after the LEDs have been soldered

When repair is unavoidable, suitable tools must be used.

(3) Die slug is to be soldered.

(4) When soldering, do not put stress on the LEDs during heating.

(5) After soldering, do not warp the circuit board.

Rev2.1, Aug 24, 2020

16

www.seoulsemicon.com

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