MBR560MFS, NRVB560MFS
THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction−to−Case, Steady State
(Assumes 600 mm2 1 oz. copper bond pad, on a FR4 board)
ELECTRICAL CHARACTERISTICS
Instantaneous Forward Voltage (Note 1)
(iF = 5 Amps, TJ = 100°C)
(iF = 5 Amps, TJ = 25°C)
Instantaneous Reverse Current (Note 1)
(Rated dc Voltage, TJ = 100°C)
(Rated dc Voltage, TJ = 25°C)
1. Pulse Test: Pulse Width = 300 ms, Duty Cycle ≤ 2.0%.
Symbol
Typ
RθJC
−
vF
0.60
0.65
iR
1.5
0.015
Max
2.4
0.72
0.78
2.5
0.150
Unit
°C/W
V
mA
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