LSGT770-KL Просмотр технического описания (PDF) - Infineon Technologies

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Компоненты Описание

производитель

LSGT770-KL

Multi TOPLED® RG

Infineon Technologies 

Lötbedingungen

Vorbehandlung nach JEDEC Level 2

Soldering Conditions Preconditioning acc. to JEDEC Level 2

IR-Reflow Lötprofil

(nach IPC 9501)

IR Reflow Soldering Profile (acc. to IPC 9501)

LSG T770

300

˚C

T 250

200

150

100

50

0

0

120 to 180 s

Ramp-up rate up to 6 K/s

Defined for Preconditioning: 2-3 K/s

50

100

OHLY0597

240-245 ˚C

10-40 s

183 ˚C

Ramp-down rate up to 6 K/s

Defined for Preconditioning: up to 6 K/s

150

200

s 250

t

2000-03-01

9

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