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ISL3170E Просмотр технического описания (PDF) - Renesas Electronics

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ISL3170E Datasheet PDF : 21 Pages
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ISL3170E, ISL3171E, ISL3172E, ISL3173E, ISL3174E, ISL3175E, ISL3176E, ISL3177E, ISL3178E
Package Outline Drawing
For the most recent package outline drawing, see M14.15.
M14.15
14 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE
Rev 1, 10/09
4
8.65
0.10 C A-B 2X
A3 6
14
8
D
DETAIL"A"
0.22±0.03
3.9
4
0.10 C D 2X
PIN NO.1
ID MARK
5
7
0.31-0.51
0.25M C A-B D
B3 6
TOP VIEW
6.0
0.20 C 2X
(0.35) x 45°
4° ± 4°
1.75 MAX
1.27
SIDE VIEW
0.10-0.25
1.25 MIN
0.10 C
H
DETAIL "A"
0.25
GAUGE PLANE
SEATING PLANE
C
0.10 C
(5.40)
(1.27)
(0.6)
TYPICAL RECOMMENDED LAND PATTERN
(1.50)
NOTES:
1. Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2. Dimensioning and tolerancing conform to AMSEY14.5m-1994.
3. Datums A and B to be determined at Datum H.
4. Dimension does not include interlead flash or protrusions.
Interlead flash or protrusions shall not exceed 0.25mm per side.
5. The pin #1 indentifier may be either a mold or mark feature.
6. Does not include dambar protrusion. Allowable dambar protrusion
shall be 0.10mm total in excess of lead width at maximum condition.
7. Reference to JEDEC MS-012-AB.
FN6307 Rev.6.00
Aug 31, 2017
Page 21 of 21

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