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ISL21007(2007) Просмотр технического описания (PDF) - Intersil

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ISL21007 Datasheet PDF : 14 Pages
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ISL21007
Ordering Information
PART NUMBER
(Note)
PART MARKING
VOUT OPTION
(V)
GRADE
TEMP. RANGE
(°C)
PACKAGE
(Pb-Free)
PKG. DWG. #
ISL21007BFB812Z 21007BF Z12
1.250
±0.5mV, 3ppm/°C
-40 to +125 8 Ld SOIC
M8.15
ISL21007CFB812Z 21007CF Z12
1.250
±1.0mV, 5ppm/°C
-40 to +125 8 Ld SOIC
M8.15
ISL21007DFB812Z 21007DF Z12
1.250
±2.0mV, 10ppm/°C
-40 to +125 8 Ld SOIC
M8.15
ISL21007BFB825Z 21007BF Z25
2.500
±0.5mV, 3ppm/°C
-40 to +125 8 Ld SOIC
M8.15
ISL21007CFB825Z 21007CF Z25
2.500
±1.0mV, 5ppm/°C
-40 to +125 8 Ld SOIC
M8.15
ISL21007DFB825Z 21007DF Z25
2.500
±2.0mV, 10ppm/°C
-40 to +125 8 Ld SOIC
M8.15
NOTE: Intersil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate
termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL
classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
*Add “-TK” suffix for tape and reel
2
FN6326.1
April 12, 2007

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