CAT25080(2018) Просмотр технического описания (PDF) - ON Semiconductor
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CAT25080 Datasheet PDF : 18 Pages
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MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
1
SCALE 2:1
UDFN8, 2x3 EXTENDED PAD
CASE 517AZ
ISSUE A
DATE 23 MAR 2015
D
AB
L
L
ÇÇ PIN ONE
REFERENCE
ÇÇÇÇ 0.10 C
0.10 C TOP VIEW
0.10 C
DETAIL B
0.08 C
NOTE 4
A1
SIDE VIEW
L1
DETAIL A
E
ALTERNATE
CONSTRUCTIONS
A3
ÉÉÇÉÉÇ ÉÉÇÉÉÇÉÉÇ EXPOSEDCu
MOLD CMPD
A
A1
A3
DETAIL B
ALTERNATE
CONSTRUCTIONS
C
SEATING
PLANE
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.25MM FROM THE TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
MILLIMETERS
DIM MIN MAX
A 0.45 0.55
A1 0.00 0.05
A3 0.13 REF
b 0.20 0.30
D
2.00 BSC
D2 1.35 1.45
E
3.00 BSC
E2 1.25 1.35
e
0.50 BSC
L 0.25 0.35
L1 −−− 0.15
GENERIC
MARKING DIAGRAM*
DETAIL A
D2
L
1
4
1
XXXXX
AWLYWG
E2
8
5
8X b
e
0.10 M C A B
BOTTOM VIEW
0.05 M C NOTE 3
XXXXX = Specific Device Code
A
= Assembly Location
WL = Wafer Lot
Y
= Year
W
= Work Week
G
= Pb−Free Package
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
RECOMMENDED
SOLDERING FOOTPRINT*
1.56
8X 0.68
1.45 3.40
1
0.50
PITCH
8X
0.30
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER: 98AON42552E
Electronic versions are uncontrolled except when
STATUS: ON SEMICONDUCTOR STANDARD
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
REFERENCE:
“CONTROLLED COPY” in red.
© Semiconductor Components Industries, LLC, 2002
http://onsemi.com
October, D20E0S2C−RRIePvT. I0ON: UDFN8, 2X3 EXTENDED PAD 1
Case Outline Number:
PAGE 1 OFX2XX
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