ZXMN6A09K Просмотр технического описания (PDF) - Diodes Incorporated.
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ZXMN6A09K Datasheet PDF : 8 Pages
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ZXMN6A09K
Maximum Ratings (@TA = +25°C unless otherwise specified.)
Characteristic
Symbol
Value
Unit
Drain-Source Voltage
VDSS
60
V
Gate-Source Voltage
VGS
20
V
(Note 6)
11.8
Continuous Drain Current
VGS = 10V TA = +70°C (Note 6)
ID
9.6
A
(Note 5)
7.7
Pulsed Drain Current
(Note 7)
IDM
43
A
Continuous Source Current (Body Diode) (Note 6)
IS
10.8
A
Pulsed Source Current (Body Diode)
(Note 7)
ISM
43
A
Thermal Characteristics (@TA = +25°C unless otherwise specified.)
Characteristic
(Note 5)
Power Dissipation
Linear Derating Factor
(Note 6)
(Note 8)
(Note 5)
Thermal Resistance, Junction to Ambient (Note 6)
(Note 8)
Thermal Resistance, Junction to Lead
(Note 9)
Operating and Storage Temperature Range
Symbol
PD
RJA
RJL
TJ, TSTG
Value
4.3
34.4
10.1
80.8
2.15
17.2
29
12.3
58.1
1.04
-55 to 150
Unit
W
mW/°C
°C/W
°C
Notes:
5. For a device surface mounted on 50mm x 50mm x 1.6mm FR4 PCB with high coverage of single sided 2oz copper, in still air conditions; the device is
measured when operating in a steady-state condition.
6. For a device surface mounted on FR4 PCB measured at t 10 sec.
7. Repetitive rating 50mm x 50mm x 1.6mm FR4 PCB, D = 0.02 and pulse width 300 µs. The pulse current is limited by the maximum junction temperature.
8. For a device surface mounted on 25mm x 25mm x 1.6mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions; the device is
measured when operating in a steady-state condition.
9. Thermal resistance from junction to solder-point (at the end of the drain lead).
ZXMN6A09K
Document Number DS33554 Rev.7 - 2
2 of 8
www.diodes.com
November 2014
© Diodes Incorporated
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