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FXL4TD245 Просмотр технического описания (PDF) - ON Semiconductor

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FXL4TD245 Datasheet PDF : 16 Pages
First Prev 11 12 13 14 15 16
Physical Dimensions
0.10 C
2X
1.80
A
B
PIN #1 IDENT
2.60
TOP VIEW
0.10 C
2X
0.10 C
0.55 MAX.
0.152
0.08 C
0.050
C
SIDE VIEW
SEATING
PLANE
5
9
0.40
1
16
13
ALL TERMINALS
0.10 C A B
0.05 C
BOTTOM VIEW
0.663
2.100
15X
0.563
1
0.400
16X
0.225
2.900
RECOMMENDED LAND PATTERN
TERMINAL SHAPE VARIANTS
0.40
0.60
0.15
0.25
0.100
PIN 1
0.100
15X
0.15
0.25
0.30
0.50
15X
NON-PIN 1
Supplier 1
0.15
0.25
PIN 1
0.30
0.50
15X
0.15
0.25
0.30 15X
0.50
NON-PIN 1
Supplier 2
A. THIS PACKAGE IS NOT CURRENTLY REGISTERED WITH
ANY STANDARDS COMMITTEE
B. DIMENSIONS ARE IN MILLIMETERS.
C. DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994
D. TERMINAL SHAPE MAY VARY ACCORDING TO PACKAGE
SUPPLIER, SEE TERMINAL SHAPE VARIANTS
E. LAND PATTERN IS A MINIMAL TOE DESIGN
F. DRAWING FILE NAME : UMLP16AREV3
Figure 5. 16-Terminal Quad, Ultrathin, Molded Leadless Package (UMLP), 1.8mm x 2.6mm
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specif-
ically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
©2006 Fairchild Semiconductor Corporation
FXL4TD245 • Rev. 1.0.6
13
www.fairchildsemi.com

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