EN5339QI Просмотр технического описания (PDF) - Altera Corporation

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EN5339QI

3A PowerSoC Low Profile Synchronous Buck DC-DC Converter with Integrated Inductor

Altera Corporation 

EN5339QI

Design Considerations for Lead-Frame Based Modules

Exposed Metal Pads on Package Bottom

QFN lead-frame based package technology utilizes exposed metal pads on the bottom of the package that

provide improved thermal dissipation, lower package thermal resistance, smaller package footprint and

thickness, larger lead size and pitch, and excellent lead co-planarity. As the EN5339 package is a fully

integrated module consisting of multiple internal devices, the lead-frame provides circuit interconnection and

mechanical support of these devices resulting in multiple exposed metal pads on the package bottom.

Only the two large thermal pads and the perimeter leads are to be mechanically/electrically connected to the

PCB through a SMT soldering process. All other exposed metal is to remain free of any interconnection to the

PCB. Figure 10 shows the recommended PCB metal layout for the EN5339 package. A GND pad with a solder

mask "bridge" to separate into two pads and 24 signal pads are to be used to match the metal on the package.

The PCB should be clear of any other metal, including traces, vias, etc., under the package to avoid electrical

shorting.

The Solder Stencil Aperture should be smaller than the PCB ground pad. This will prevent excess solder from

causing bridging between adjacent pins or other exposed metal under the package. Please consult EN5339QI

QFN Package Soldering Guidelines for more details and recommendations.

Figure 10. Recommended Footprint for PCB (Top View)

Note: Grey area highlights exposed metal that is not to be mechanically or electrically connected to the PCB.

06903

June 26, 2015

www.altera.com/enpirion, Page 18

Rev E

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