AH11-G Просмотр технического описания (PDF) - TriQuint Semiconductor
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AH11-G Datasheet PDF : 7 Pages
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AH11
High Dynamic Range Dual Amplifier
Pin Description
Pin
1
2, 3, 6, 7
4
5
8
n/a
Label
RF In (Amp 1)
Ground
RF In (Amp 2)
RF Out (Amp 2)
RF Out (Amp 1)
Backside Paddle
Description
RF Input. Requires matching circuit to 50 Ω. See application circuits.
RF/DC ground. Provide via path to ground.
RF Input. Requires matching circuit to 50 Ω. See application circuits.
RF Output. Requires DC blocking capacitor. See application circuits.
RF Output. Requires DC blocking capacitor. See application circuits.
Use recommended via pattern to minimize inductance and thermal resistance
Applications Information
PC Board Layouts
PCB Material (stackup):
1/2oz. Cu top layer
0.014 inch Nelco N-4000-13
1/2oz. Cu middle layer 1
Core Nelco N-4000-13
1/2 Cu middle layer 2
0.014 inch Nelco N-4000-13
1/2oz. Cu bottom layer
Finished board thickness is 0.062±.006
The pad pattern shown has been developed and tested for
optimized assembly at TriQuint Semiconductor. The PCB land
pattern has been developed to accommodate lead and package
tolerances. Since surface mount processes vary from company to
company, careful process development is recommended.
For further technical information, Refer to
http://www.triquint.com/prodserv/more_info/default.aspx?prod_id=AH11
Data Sheet: Rev A 0 6/23/11
© 2011 TriQuint Semiconductor, Inc.
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Disclaimer: Subject to change without notice
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