HIN207ECAZ Просмотр технического описания (PDF) - Renesas Electronics
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Компоненты Описание
производитель
HIN207ECAZ
Renesas Electronics
HIN207ECAZ Datasheet PDF : 20 Pages
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HIN202, HIN206, HIN207, HIN208, HIN211, HIN213
Shrink Small Outline Plastic Packages (SSOP)
N
INDEX
AREA
H
E
-B-
0.25(0.010) M B M
GAUGE
PLANE
123
-A- D
SEATING PLANE
A
L
0.25
0.010
-C-
µ
e
A1
A2
C
B
0.10(0.004)
0.25(0.010) M C A M B S
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.20mm
(0.0078 inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Inter-
lead flash and protrusions shall not exceed 0.20mm (0.0078 inch) per
side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “B” does not include dambar protrusion. Allowable dambar
protrusion shall be 0.13mm (0.005 inch) total in excess of “B” dimen-
sion at maximum material condition.
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact.
M24.209 (JEDEC MO-150-AG ISSUE B)
24 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE
INCHES
MILLIMETERS
SYMBOL MIN
MAX
MIN
MAX NOTES
A
-
0.078
-
2.00
-
A1
0.002 -
0.05
-
-
A2
0.065 0.072 1.65
1.85
-
B
0.009 0.014 0.22
0.38
9
C
0.004 0.009 0.09
0.25
-
D
0.312 0.334 7.90
8.50
3
E
0.197 0.220 5.00
5.60
4
e
0.026 BSC
0.65 BSC
-
H
0.292 0.322 7.40
8.20
-
L
0.022 0.037 0.55
0.95
6
N
24
24
7
0o
8o
0o
8o
-
Rev. 1 3/95
FN3980 Rev 19.00
August 6, 2015
Page 18 of 20
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