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NDS351AN Просмотр технического описания (PDF) - Fairchild Semiconductor

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производитель
NDS351AN Datasheet PDF : 6 Pages
1 2 3 4 5 6
Typical Electrical Characteristics (continued)
5
VDS = 5.0V
4
3
2
T J = -55°C
25°C
125°C
1
0
0
1
2
3
4
5
I , DRAIN CURRENT (A)
D
Figure 13. Transconductance Variation with
Drain Current and Temperature.
20
10
5
3
1
RDS(ON) LIMIT
1ms
10ms
100ms
0.3
0.1
VGS = 4.5V
SINGLE PULSE
0.03
RθJA =See Note1b
TA = 25°C
0.01
0.1 0.2
0.5 1
2
1s
10s
DC
5
10 20 30 50
V , DRAI N-SOURCE VOLTAGE (V)
DS
Figure 14. Maximum Safe Operating Area.
1
0.8
0.6 1a
1b
0.4
0.2
0
0
4.5"x5" FR-4 Board
TA = 25 oC
Still Air
0.1
0.2
0.3
0.4
2oz COPPER MOUNTING PAD AREA (in 2 )
1.6
1.4
1.2
1a
1b
1
0.8
0
4.5"x5" FR-4 Board
TA = 2 5 o C
Still Air
VG S = 4 . 5 V
0.1
0.2
0.3
0.4
2oz COPPER MOUNTING PAD AREA (in 2 )
Figue 15. SuperSOTTM _ 3 Maximum
Steady-State
Power Dissipation versus Copper Mounting Pad Area.
Figure 16. Maximum Steady-State Drain
Current versus Copper Mounting Pad Area.
1
0.5
D = 0.5
0.2
0.1
0.05
0.02
0.01
0.005
0.2
0.1
0.05
0.02
0.01
Single Pulse
0.002
0.001
0.0001
0.001
0.01
0.1
1
t1, TIME (sec)
R θJA (t) = r(t) * RθJA
R θJA = See Note 1b
P(pk)
t1
t2
TJ - TA = P * RθJA (t)
Duty Cycle, D = t1 /t2
10
100
300
Figure 17. Transient Thermal Response Curve.
Note : Characterization performed using the conditions described in note 1b. Transient thermal response will
change depending on the circuit board design.
NDS351AN Rev. C

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