55110IRZ Просмотр технического описания (PDF) - Intersil

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Компоненты Описание

производитель

55110IRZ

Dual, High Speed MOSFET Driver

Intersil 

ISL55110, ISL55111

Package Outline Drawing

M8.173

8 LEAD THIN SHRINK SMALL OUTLINE PACKAGE (TSSOP)

Rev 2, 01/10

A

24

3.0 ±0.5

8

5

SEE DETAIL "X"

6.40

4.40 ±0.10

CL

3

4

PIN 1

ID MARK

0.20 C BA

1

4

0.65

B

TOP VIEW

0.09-0.20

END VIEW

H

C

SEATING

PLANE

0.10 C

0.05

1.20 MAX

0.25 +0.05/-0.06

6

0.10 C B A

SIDE VIEW

0.90 +0.15/-0.10

0.05 MIN

0.15 MAX

1.00 REF

DETAIL "X"

GAUGE

PLANE

0.25

0°-8°

0.60 ±0.15

(5.65)

(1.45)

PACKAGE BODY

OUTLINE

(0.35 TYP)

(0.65 TYP)

TYPICAL RECOMMENDED LAND PATTERN

Submit Document Feedback 18

NOTES:

1. Dimensions are in millimeters.

Dimensions in ( ) for Reference Only.

2. Dimension does not include mold flash, protrusions or

gate burrs. Mold flash, protrusions or gate burrs shall

not exceed 0.15 per side.

3. Dimension does not include interlead flash or protrusion.

Interlead flash or protrusion shall not exceed 0.15 per side.

4. Dimensions are measured at datum plane H.

5. Dimensioning and tolerancing per ASME Y14.5M-1994.

6. Dimension on lead width does not include dambar protrusion.

Allowable protrusion shall be 0.08 mm total in excess of

dimension at maximum material condition. Minimum space

between protrusion and adjacent lead is 0.07mm.

7. Conforms to JEDEC MO-153, variation AC. Issue E

FN6228.8

January 29, 2015

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