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Компоненты Описание
HCS273K/SAMPLE Просмотр технического описания (PDF) - Intersil
Номер в каталоге
Компоненты Описание
производитель
HCS273K/SAMPLE
Radiation Hardened Octal D Flip-Flop
Intersil
HCS273K/SAMPLE Datasheet PDF : 9 Pages
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Die Characteristics
DIE DIMENSIONS:
108 x 106 mils
METALLIZATION:
Type: AlSi
Metal Thickness: 11k
Å
±
1k
Å
GLASSIVATION:
Type: SiO
2
Thickness: 13k
Å
±
2.6k
Å
WORST CASE CURRENT DENSITY:
<2.0 x 10
5
A/cm
2
BOND PAD SIZE:
100
µ
m x 100
µ
m
4 mils x 4 mils
Metallization Mask Layout
D0
(3)
HCS273MS
HCS273MS
Q0
MR
VCC
Q7
(2)
(1)
(20)
(19)
D1 (4)
Q1 (5)
Q2 (6)
(18) D7
(17) D6
(16) Q6
(15) Q5
D2 (7)
(14) D5
(8)
(9)
D3
Q3
(10) (11)
GND CP
(12)
(13)
Q4
D4
NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location.
The mask series for the HCS273 is TA14307B.
Spec Number
518767
344
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