GTL2003 Просмотр технического описания (PDF) - NXP Semiconductors.
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GTL2003 Datasheet PDF : 24 Pages
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NXP Semiconductors
22. Contents
1
General description . . . . . . . . . . . . . . . . . . . . . . 1
2
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
3
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
4
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
4.1
Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 2
5
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2
6
Pinning information . . . . . . . . . . . . . . . . . . . . . . 3
6.1
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
6.2
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
7
Functional description . . . . . . . . . . . . . . . . . . . 4
7.1
Function selection. . . . . . . . . . . . . . . . . . . . . . . 4
8
Application design-in information . . . . . . . . . . 5
8.1
Bidirectional translation . . . . . . . . . . . . . . . . . . 5
8.2
Unidirectional down translation. . . . . . . . . . . . . 6
8.3
Unidirectional up translation . . . . . . . . . . . . . . . 6
8.4
Sizing pull-up resistor . . . . . . . . . . . . . . . . . . . . 7
9
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 8
10
Recommended operating conditions. . . . . . . . 8
11
Static characteristics. . . . . . . . . . . . . . . . . . . . . 9
12
Dynamic characteristics . . . . . . . . . . . . . . . . . 10
12.1
Dynamic characteristics for translator-type
application . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
12.2
Dynamic characteristics for CBT-type
application . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
13
Test information . . . . . . . . . . . . . . . . . . . . . . . . 12
14
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 13
15
Soldering of SMD packages . . . . . . . . . . . . . . 15
15.1
Introduction to soldering . . . . . . . . . . . . . . . . . 15
15.2
Wave and reflow soldering . . . . . . . . . . . . . . . 15
15.3
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 15
15.4
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 16
16
Soldering: PCB footprints. . . . . . . . . . . . . . . . 18
17
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 20
18
References . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
19
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 21
20
Legal information. . . . . . . . . . . . . . . . . . . . . . . 22
20.1
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 22
20.2
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
20.3
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
20.4
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 23
21
Contact information. . . . . . . . . . . . . . . . . . . . . 23
22
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
GTL2003
8-bit bidirectional low voltage translator
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2012.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 3 July 2012
Document identifier: GTL2003
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