NXP Semiconductors
Footprint information for reflow soldering of DHVQFN20 package
GTL2003
8-bit bidirectional low voltage translator
SOT764-1
0.290
5.750
4.800
0.500
0.650
0.025
0.025
0.105
3.750 2.800
0.400 0.900 1.700 3.700
1.700
2.900
3.500
5.500
Refer to the package outline drawing for actual layout
solder land
solder paste deposit
solder land plus solder paste
occupied area
Fig 15. PCB footprint for SOT764-1 (TSSOP20); reflow soldering
GTL2003
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 3 July 2012
© NXP B.V. 2012. All rights reserved.
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