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BGA2003 Просмотр технического описания (PDF) - NXP Semiconductors.

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Компоненты Описание
производитель
BGA2003
NXP
NXP Semiconductors. NXP
BGA2003 Datasheet PDF : 13 Pages
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NXP Semiconductors
Silicon MMIC amplifier
Product specification
BGA2003
FEATURES
Low current
Very high power gain
Low noise figure
Integrated temperature compensated biasing
Control pin for adjustment bias current
Supply and RF output pin combined.
PINNING
PIN
1
2
3
4
DESCRIPTION
GND
RF in
CTRL (bias current control)
VS + RF out
APPLICATIONS
RF front end
Wideband applications, e.g. analog and digital cellular
telephones, cordless telephones (PHS, DECT, etc.)
Low noise amplifiers
Satellite television tuners (SATV)
High frequency oscillators.
DESCRIPTION
Silicon MMIC amplifier consisting of an NPN double
polysilicon transistor with integrated biasing for low voltage
applications in a plastic, 4-pin SOT343R package.
handbook, halfpage
3
4
CTRL VS+RFout
BIAS
CIRCUIT
2
Top view
1
MAM427
RFin
GND
Marking code: A3*
* = - : made in Hong Kong
* = p : made in Hong Kong
* = t : made in Malaysia
Fig.1 Simplified outline (SOT343R) and symbol.
QUICK REFERENCE DATA
SYMBOL
VS
IS
PARAMETER
DC supply voltage
DC supply current
MSG
maximum stable gain
NF
noise figure
CONDITIONS
RF input AC coupled
VVS-OUT = 2.5 V; ICTRL = 1 mA;
RF input AC coupled
VVS-OUT = 2.5 V; f = 1800 MHz;
Tamb = 25 °C
VVS-OUT = 2.5 V; f = 1800 MHz; ΓS = Γopt
TYP.
11
16
1.8
MAX.
4.5
UNIT
V
mA
dB
dB
2010 Sep 13
2

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