Q62702-G0079(2001) Просмотр технического описания (PDF) - Infineon Technologies

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Компоненты Описание

производитель

Q62702-G0079
(Rev.:2001)

GaAs MMIC

Infineon Technologies 

GaAs Components

Soldering Recommendation

• Foot Print

• Soldering

Soldering profile:

Ramp-up preheating

Ramp-up peak

Exposure to molten solder

Typ. solder temperature

Peak temperature

Ramp-down

Comments

• Solder Paste Thickness

• Control of Soldering (voids)

• JEDEC A-112A

• IPC-9501 (IPC-4202)

CGY 98

Drawing C63060-A2120-A001-01-0027

Wave soldering: unsuitable

Reflow soldering: suitable, max. 3 times

(IR or VPR)

Temperature gradient: max. + 2 K/s

Time at 100 - 150 °C: min. 90 s

Temperature gradient: max. + 6 K/s

Above 183 °C

max. 150 s

Typ. 215 - 245 °C max. 30 s

Max. peak 260 °C max. 10 s

Temperature gradient: min. – 6 °C/s

(see also soldering standard profile of data book

“Package information”)

Slow ramp-up, long preheating phase and low max.

temperature recommended

150 - 200 µm

- Visual inspection

- Cross sectioning

- Measurement of case temperature /

thermal resistance case to ambient

Level 1 storage floor life at 30 °C / 90%

unlimited

Level 111 storage floor life at 30 °C / 60%

unlimited

IR/Convection; max. 245 °C; < 6 K/s

Data Sheet

14

2001-01-01

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