DatasheetQ Logo
Electronic component search and free download site. Transistors,MosFET ,Diode,Integrated circuits

ADP3408ARU-1.8(Rev0) Просмотр технического описания (PDF) - Analog Devices

Номер в каталоге
Компоненты Описание
производитель
ADP3408ARU-1.8
(Rev.:Rev0)
ADI
Analog Devices ADI
ADP3408ARU-1.8 Datasheet PDF : 16 Pages
First Prev 11 12 13 14 15 16
ADP3408
Appropriate sense resistors are available from the following
vendors:
Vishay Dale
IRC
Panasonic
Charger FET Selection
The type and size of the pass transistor is determined by the
threshold voltage, input-output voltage differential, and the
charge current. The selected PMOS must satisfy the physical,
electrical and thermal design requirements.
To ensure proper operation, the minimum VGS the ADP3408
can provide must be enough to turn on the FET. The available
gate drive voltage can be estimated using the following:
VGS = VADAPTER ( MIN ) VGATEDR VSENSE
(8)
where:
VADAPTER(MIN) is the minimum adapter voltage, VGATEDR is the
gate drive lowvoltage, 0.5 V, and VSENSE is the maximum
high current limit threshold voltage.
The difference between the adapter voltage (VADPTER) and the
final battery voltage (VBAT) must exceed the voltage drop due to
the blocking diode, the sense resistor, and the ON resistance of
the FET at maximum charge current, where:
VDS = VADAPTER( MIN ) VDIODE VSENSE VBAT
(9)
The RDS(ON) of the FET can then be calculated.
RDS(ON )
=
VDS
ICHR ( MAX )
(10)
The thermal characteristics of the FET must be considered
next. The worst-case dissipation can be determined using:
( ) PDISS = VADAPTER (MAX ) VDIODE VSENSE UVLO × ICHR (11)
It should be noted that the adapter voltage can be either
preregulated or nonregulated. In the preregulated case the
difference between the maximum and minimum adapter voltage
is probably not significant. In the unregulated case, the adapter
voltage can have a wide range specified. However, the maximum
voltage specified is usually with no load applied. So, the worst-case
power dissipation calculation will often lead to an over-specified
pass device. In either case, it is best to determine the load
characteristics of the adapter to optimize the charger design.
For example:
VADAPTER(MIN) = 5.0 V
VADAPTER(MAX) = 6.5 V
VDIODE = 0.5 V at 800 mA
VSENSE = 160 mV
VGATEDR = 0.5 V
VGS = 5 V 0.5 V 160 V = 4.34 V
Therefore, choose a low threshold voltage FET.
VDS = VADAPT ( MIN ) VDIODE VSENSE VBAT =
5V 0.5V 0.160 V 4.2 V = 140 mV
RDS(ON )
=
VDS
ICHR( MAX )
=
140 mV
800 mA
= 175 m
( ) PDISS = VADAPT ( MAX ) VDIODE VSENSE UVLO × ICHR
( ) PDISS = 6.5V 0.5V 0.160 V 3.2 × 0.8 A = 2.11W
Appropriate PMOS FETs are available from the following
vendors:
Siliconix
IR
Fairchild
Charger Diode Selection
The diode, D1, shown in Figure 2, is used to prevent the battery from
discharging through the PMOSbody diode into the chargers
internal bias circuits. Choose a diode with a current rating high
enough to handle the battery charging current and a voltage
rating greater than VBAT. The blocking diode is required for
both lithium and nickel battery types.
Printed Circuit Board Layout Considerations
Use the following general guidelines when designing printed
circuit boards:
1. Connect the battery to the VBAT, VBAT2, and VRTCIN
pins of the ADP3408. Locate the input capacitor as close to
the pins as possible.
2. VAN and VTCXO capacitors should be returned to AGND.
3. VCORE, VMEM and VSIM capacitors should be returned
to DGND.
4. Split the ground connections. Use separate traces or planes
for the analog, digital, and power grounds and tie them together
at a single point, preferably close to the battery return.
5. Run a separate trace from the BATSNS pin to the battery to
prevent voltage drop error in the MVBAT measurement.
6. Kelvin-connect the chargers sense resistor by running sepa-
rate traces to the CHRIN and ISENSE pins. Make sure that the
traces are terminated as close to the resistors body as possible.
7. Use the best industry practice for thermal considerations
during the layout of the ADP3408 and charger components.
Careful use of copper area, weight, and multilayer construc-
tion all contribute to improved thermal performance.
REV. 0
–15–

Share Link: 

datasheetq.com  [ Privacy Policy ]Request Datasheet ] [ Contact Us ]