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EVAL-AD5755-1SDZ Просмотр технического описания (PDF) - Analog Devices

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EVAL-AD5755-1SDZ Datasheet PDF : 45 Pages
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Data Sheet
AD5757
Pin No.
49
51
54
56
57
58
59
61
62
63
64
Mnemonic
IGATEC
CHARTC
IOUT_D
VBOOST_D
COMPDCDC_D
IGATED
CHARTD
REFIN
REFOUT
RSET_D
RSET_C
EPAD
Description
Optional Connection for External Pass Transistor. Leave unconnected when using the dc-to-dc converter. See
the External PMOS Mode section for more information.
HART Input Connection for DAC Channel C. For more information, see the HART section. If unused, leave as an
open circuit.
Current Output Pin for DAC Channel D.
Supply for Channel D Current Output Stage (see Figure 50). To use the dc-to-dc feature of the device, connect as
shown in Figure 57.
DC-to-DC Compensation Capacitor. Connect a 10 nF capacitor from this pin to ground. Used to regulate the
feedback loop of the Channel D dc-to-dc converter. Alternatively, if using an external compensation resistor,
place a resistor in series with a capacitor to ground from this pin (see the DC-to-DC Converter Compensation
Capacitors and AICC Supply Requirements—Slewing sections in t section for more information).
Optional Connection for External Pass Transistor. Leave unconnected when using the dc-to-dc converter. See
the External PMOS Mode section for more information.
HART Input Connection for DAC Channel D. For more information, see the HART section. If unused, leave as an
open circuit.
External Reference Voltage Input.
Internal Reference Voltage Output. It is recommended to place a 0.1 µF capacitor between REFOUT and
REFGND. REFOUT must be connected to REFIN to use the internal reference.
An external, precision, low drift 15 kΩ current setting resistor can be connected to this pin to improve the IOUT_D
temperature drift performance. See the Device Features section.
An external, precision, low drift 15 kΩ current setting resistor can be connected to this pin to improve the IOUT_C
temperature drift performance. See the Device Features section.
Exposed Pad. This exposed pad must be connected to AGND, or, alternatively, it can be left electrically
unconnected. It is recommended that the pad be thermally connected to a copper plane for enhanced
thermal performance.
Rev. G | Page 13 of 45

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