KSZ9031RNX Просмотр технического описания (PDF) - Microchip Technology

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KSZ9031RNX

Gigabit Ethernet Transceiver with RGMII Support

Microchip Technology 

KSZ9031RNX

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.

PART NO.

X

XX

X

X

Device Interface Package Temperature Bond Wire

Device:

Interface:

Package:

Temperature:

Bond Wire:

KSZ9031

R = RGMII

NX = 48-pin QFN or WQFN

C = 0C to +70C (Commercial)

I = –40C to +85C (Industrial)

U = –40C to +85C (Automotive)

V = –40C to +105C (Automotive Extended)

A = Gold

C = Copper

Examples:

a) KSZ9031RNXCA

RGMII Interface

48-pin QFN (Pb-Free, 3.5 mm x 3.5 mm ePad)

Commercial Temperature

Gold Wire Bonding

b) KSZ9031RNXCC

RGMII Interface

48-pin QFN (Pb-Free, 5.1 mm x 5.1 mm ePad)

Commercial Temperature

Copper Wire Bonding

c) KSZ9031RNXIA

RGMII Interface

48-pin QFN (Pb-Free, 3.5 mm x 3.5 mm ePad)

Industrial Temperature

Gold Wire Bonding

d) KSZ9031RNXIC

RGMII Interface

48-pin QFN (Pb-Free, 5.1 mm x 5.1 mm ePad)

Industrial Temperature

Copper Wire Bonding

e) KSZ9031RNXUA

RGMII Interface

48-pin WQFN

(Pb-Free, 5.05 mm x 5.05 mm ePad)

Automotive Temperature

Gold Wire Bonding

f) KSZ9031RNXVA

RGMII Interface

48-pin WQFN

(Pb-Free, 5.05 mm x 5.05 mm ePad)

Automotive Extended Temperature

Gold Wire Bonding

DS00002117C-page 76

 2016 Microchip Technology Inc.

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