UPC2748TB-E3 Просмотр технического описания (PDF) - NEC => Renesas Technology

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производитель

UPC2748TB-E3

3 V, SUPER MINIMOLD SILICON MMIC AMPLIFIER FOR MOBILE COMMUMICATIONS

NEC => Renesas Technology 

µPC2747TB, µPC2748TB

NOTES ON CORRECT USE

(1) Observe precautions for handling because of electro-static sensitive devices.

(2) Form a ground pattern as wide as possible to minimize ground impedance (to prevent undesired oscillation).

All the ground pins must be connected together with wide ground pattern to decrease impedance difference.

(3) The bypass capacitor should be attached to VCC line.

(4) The DC cut capacitor must be attached to input pin.

RECOMMENDED SOLDERING CONDITIONS

This product should be soldered under the following recommended conditions. For soldering methods and

conditions other than those recommended below, contact your NEC sales representative.

Soldering Method

Infrared Reflow

VPS

Wave Soldering

Partial Heating

Soldering Conditions

Package peak temperature: 235 °C or below

Time: 30 seconds or less (at 210 °C)

Count: 3, Exposure limit: NoneNote

Package peak temperature: 215 °C or below

Time: 40 seconds or less (at 200 °C)

Count: 3, Exposure limit: NoneNote

Soldering bath temperature: 260 °C or below

Time: 10 seconds or less

Count: 1, Exposure limit: NoneNote

Pin temperature: 300 °C

Time: 3 seconds or less (per side of device)

Exposure limit: NoneNote

Recommended Condition Symbol

IR35-00-3

VP15-00-3

WS60-00-1

–

Note After opening the dry pack, keep it in a place below 25 °C and 65 % RH for the allowable storage period.

Caution Do not use different soldering methods together (except for partial heating).

For details of recommended soldering conditions for surface mounting, refer to information document

SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).

Data Sheet P13444EJ2V0DS00

17

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